Hello all of you out there

I am starting a FMEA (potential failure analysis) regarding a product which
is planned to be transferred to lead free soldering (date not clear yet).
We are pushing our customer to use the alloys which are the outcome of the
NEMI study (SnAgCu).
The product is quite complex:
Size about 18* 14 inch PCB thickness: 0.15 inch ENIG (perhaps Im. Sn in the
future)
Press fit
0402
~30 BGA (800 balls)
We know from pervious experiments that according to shear test the
strangeness of the solder joint with SnCuAg is higher if the correct
component finish is used.
The customer is looking for a statement from us about reliability issues if
the go to lead free (15 year warranties).
His concern is that the results on the test board's are not fully comparable
to the reality.
What is your recommendation:
Which test should be used Twist and Bending , T cycles, T shock....
What is the most critical think according to your opinion (brittle fraction
of BGA solder joints because of mechanical bending ?)
Would you change land and stencil design?
Which standards would you use to qualify the PCBA for the product?

Any Input welcome

Siggi



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Kind regards / Mit freundlichen Grüßen

Dr. Siegmund Zweigart
New Technology Manager

Solectron GmbH
Solectronstrasse 2              Fon. ++49 7032 998 194
D - 71083 Herrenberg         Fax  ++49 7032 998 222

e-mail: [log in to unmask] <mailto:[log in to unmask]> 
internet: www.solectron.com <http://www.solectron.com> 
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