Hi Mike,
>Is it fair to use surface copper measurements near PTH's to characterize the
copper >thickness of PWB's?
ANSWER: No, it is much more technically important and accurate to measure the
plating thickness in the PTH.
>Could subsequent processing in the absence of solder resist result in
lowered copper >thickness?
ANSWER: Yes, it certainly will.
>Does any military or industry specification mandate or even suggest
appropriate areas for >surface copper measurement?
ANSWER: No, measurements are to be inside the PTH--see for instance IPC-D-279.


Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

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