Perhaps someone can give me an opinion on this one.

I've been asked to approve the design of a surface mount device which has QFP
type legs, 0.75mm wide on a 1.4mm pitch.

The vendor is recommending a PCB pad layout for the device where the pads are
1.05 wide on (obviously) a 1.40mm pitch. The part would be used in high volume
consumer electronics.

Would anyone out there anticipate any soldering problems with this geometry? I
had a look through IPC-SM-782 but didn't find it much help.

Thanks,

--
Eric Christison
Mechanical Engineer
STMicroelectronics
33 Pinkhill
Edinburgh
EH12 7BF

tel:    +44 (0)131 336 6165
fax:    +44 (0)131 336 6001

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