Hey Eddie,

I've never heard of anyone wanting lamination (resin) voids intentionally,
ha ha.  You might tinker with a sequential lam and a forming release sheets
(oh, what's that stuff called? - racking Diet Coke soaked brain).

The alternative of mechanically removing the unneeded layers but I wouldn't
a high volume job.

As a demo sample we laminated a board half with prepreg and the other half
without.  The copper tarnished but it was a great visual aid.  Something
similar might work for ya.

H

~~~~~~~~~~~~~~~~~~~~~~~~~~~
Hans M. Hinners
AC-130 Systems Engineer (Hardware)
Warner Robins Air Logistics Center (WR-ALC)
226 Cochran Street
Robins AFB, GA 31098-1622
Tele: (478) 926 - 5847 [DSN Prefix: 468]
Fax: (478) 926 - 4911
mailto:[log in to unmask]

-----Original Message-----
From: Eddie Rocha [mailto:[log in to unmask]]
Sent: Friday, February 21, 2003 2:19 PM
To: [log in to unmask]
Subject: [TN] Multilyayer w/ open cavities


Any advise on the best approach on how to build a multilayer PCB
with open cavities exposing an internal layer?

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