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Date: | Wed, 19 Feb 2003 08:43:22 -0500 |
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Electrolytic Ni or electroless Ni? How thick is the layer, composition?
Shape, location? Diffusion parameter (how hot and how long)?
Environmental requirement (operation temp)? Application of "particular"
Etc..
jk
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Dennis Fritz
>Sent: Tuesday, February 18, 2003 9:10 PM
>To: [log in to unmask]
>Subject: Re: [TN]
>
>
>Just wondering if any of you metallurgists have a comment
>about copper tin intermetallics vs. nickel tin. We have heard
>the NiSn IMC is indeed more brittle than the CuSn IMC's. This
>is the contention of one particular industry group.
>
>Denny Fritz
>MacDermid, Inc.
>
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