Hi Larry,

Forgive me but I don't understand exactly what you mean with
"solderthickness at the crown"
Are you referring to maximum HASL thickness????

Jowan
  -----Original Message-----
  From: [log in to unmask] [mailto:[log in to unmask]]
  Sent: dinsdag 18 februari 2003 18:54
  To: [log in to unmask]
  Subject: Re: [TN] 16mil QFP Process Issues


  Jowan and other Technetters,

  There is something about flatness that has been bothering me for years.
If you have a 1:1 appeture to pad ratio, a solder thickness at the crown of
1 mill or less (which everyone seems to agree with), correct registration
and a 4 mil stencil thickness why do you think the solder paste will not be
flat to the component leads?  Just curious.

  Larry


 ========================================================================
DISCLAIMER:
The information contained in this communication is confidential and may be legally privileged.
It is intended solely for the use of the individual or entity to whom it is addressed and others
authorized to receive it. If you are not the intended recipient, you are hereby notified that any
disclosure, copying, distribution, or taking any action in reliance of the contents of this information
is strictly prohibited and may be unlawful. Stork is neither liable for the proper and complete
transmission of the information contained in this communication nor for any delay in its receipt.

---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------