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Date: | Tue, 18 Feb 2003 14:39:49 EST |
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Hi Per-Erik,
Thanks for the info. Is it possible for you to send me a copy of P.L. Tu et
al. "Effect of Intermetallic Compounds on Vibration Fatigue of µBGA Solder
Joints," IEEE Trans. on Advanced Pack., Vol. 24, No.2, 2001? Unfortunately, I
do not have acces to IEEE Trans.
>the crack formation moved from the board side (Ni/solder interface) to the
component side (Cu/solder interface) < would imply interfacial separation not
cracks in the IMC?
>CU-IMC/solder interface or between Cu6Sn5 and Cu3Sn IMC layers<, both of
these are interfacial, but "between Cu6Sn5 and Cu3Sn IMC layers" is
definitely a new one for me--sure cannot think of a good mechanism.
One possibility is impurities accummulting at these interfaces given the long
exposure to 120C; this would also explain the move from the board side
(Ni/solder interface) to the component side (Cu/solder interface).
Regards,
Werner Engelmaier
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