TECHNET Archives

February 2003

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sun, 16 Feb 2003 21:13:03 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (22 lines)
Hi,
As Dave indicated, we were busy. I concur with Dave, the solder
microstructure is not the issue. As Dave pointed out
nonuniformity/non-symetricalness of the solder joint shape can result from
the 'disturbance'; I have also observed a weakened zone from the
'disturbance' which caused significantly earlier failures. In my testing
{0<->100C] which typically lasts in excess of 10,000 cycles, the difference
for 'disturbed' SJs can be several thousands of cycles.

Werner Engelmaier

---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

ATOM RSS1 RSS2