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| Reply To: | TechNet E-Mail Forum. |
| Date: | Fri, 14 Feb 2003 17:08:46 -0600 |
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Hi Yannick! Take a look at JSTD-001B specification in the section 9 tables
- if the IC leads are exposed/nonplated due to shearing then you will not
get any wetting (nonwetting due to component design). You would need a very
aggressive flux chemistry to get wetting in these regions due to the
exposure the sheared edge metallization has undergone. Take a look at your
heel fillets - if they meet the 001/610 specification requirements then the
solder joint quality is good. Good Luck.
Dave Hillman
Rockwell Collins
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Yannick Brisson
<[log in to unmask]> To: [log in to unmask]
Sent by: TechNet cc:
<[log in to unmask]> Subject: [TN] Copper on lead
02/12/2003 04:18
PM
Please respond to
"TechNet E-Mail
Forum."; Please
respond to
Yannick Brisson
Hello,
I'm wondering if someone had issue with copper on IC lead. We had a
batch
of IC where we find that on the side of the lead and at the front about 1/4
of the lead that have copper. It's seem that the lead have been cut and
didn't get plated. What do you think we shuold do to get a good solder
joint. Because right now the solder stop where the copper begin. We use a
no-clean paste. Should we go to a more aggressive paste? like water
solube?
shuold we change our profile?, we get a peak of 220celcius.
Or anything else you have try?
Thanks You
Yannick Brisson
============================
Technicien SMT
Technician SMT
M2S Électronique
2855, Rue de Celles
Québec, Québec
G2C 1K7
Téléphone: (418) 842-1312 Ext: 264
Télécopie: (418) 842-0123
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