Hello

Thanks a lot for your answers.
They are all quite in line with my opinion.
Regarding the rumors:
I heard the same rumors that a product was changed to lead free and than
back. But I have no idea if it was a real product change or just a trial in
the lab.
I heard that the reason was surface finish of components because they had to
use some components with SnPb Finish.
I heard this information only from a single side, so I am not sure about it
at all.

Siggi

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Kind regards / Mit freundlichen Grüßen

Dr. Siegmund Zweigart
New Technology Manager

Solectron GmbH
Solectronstrasse 2              Fon. ++49 7032 998 194
D - 71083 Herrenberg         Fax  ++49 7032 998 222

e-mail: [log in to unmask] <mailto:[log in to unmask]> 
internet: www.solectron.com <http://www.solectron.com> 
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        ----------
        From:  Joe Fjelstad [SMTP:[log in to unmask]]
        Sent:  Dienstag, 18. Februar 2003 15:12
        To:  [log in to unmask]
        Subject:  Re: [LF] Relaibility / Leadfree

        Hello Siggi, 
	
        You should also be on the look out for tin whiskers if you are press
fitting into high tin (>90%) solders. Compressive stress has been implicated
at an initiation factor in a study by Aerospace Corporation. Voiding is also
more prominent with lead-free solders according to a paper given at the
Military Aerospace COTS lead-free seminar last week in LA. It might be a
contributing factor in bending failure. 
	
        On another matter, I have heard rumor that one major OEM supplier of
a communication device introduced it as lead-free but has quietly converted
it back to traditional solders for unspecified reasons. I am I alone in
hearing this rumor? If true what was the reason, relaibility? cost?  (an off
line reply to this question is preferred and requested) 
	
        Kind regards, 
        Joe
	
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