We saw no increase in process defects.  We made no adjustments to placement.  All parts already met the class 3 placement requirements.  No, we do not allow glue in the smd solder joints.  This isn't an issue with any of our class 2 products.  PTH's normally all have 90% or better vertical fill. 

We just don't have to make these border line decisions.  We really emphasize the optimal process on the initial set up and first article/run authorization process.  We correct and monitor as soon as the process starts to slide.  

As far as manual assembly processing we controlled this through the process instructions and training.  The class 3 products we have built went through manufacturing as easily as any class 2 product we build.  We put more focus on the front and the back end is easy.  

Kat


OUP.COM 02/26/03 10:58AM >>>
Hi Cathy,

It depends on the actual output of your current process. How much
rejects would you have if you would inspect your standard products
against the higher level specification ?  Do you normally have SMD-glue
in the solder joints ?  Are your QFP's placed with more than 25%
overhang ?  How far can you normally fill the PTH's in the wavesoldering
process ?
If your process is well under control I'd say the biggest impact is in
the area of manual assembly instructions.

Daan Terstegge
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net

>>> [log in to unmask] 02/26/03 05:38pm >>>
Hi,
Just a couple of questions,

What changes do you make in your process to build a class 3 product
when you
originally build to class 2?

How do you incorporate this into the pricing of the product?


Cathy Killen
Training Officer
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