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February 2003

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"TechNet E-Mail Forum." <[log in to unmask]>, Rick Thompson <[log in to unmask]>
Date:
Wed, 26 Feb 2003 12:16:12 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>, Yannick Brisson <[log in to unmask]>
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Yannick Brisson <[log in to unmask]>
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Hi,

  I had a demo of the metcal station et ERSA.  And I prefer Ersa, with all
the option you could see the joint during reflow, it's IR so you only reflow
one component, not the others around.  The system is easy to learn.  I think
is not too expensive.  But you won't find many used equipment on the market(
if so tell me I'm interested!!)

 Bye

Yannick Brisson
============================
Technicien SMT
Technician SMT
M2S Électronique
2855, Rue de Celles 
Québec, Québec
G2C 1K7
Téléphone: (418) 842-1312 Ext: 264
Télécopie: (418) 842-0123
[log in to unmask]
============================


> -----Message d'origine-----
> De:   Rick Thompson [SMTP:[log in to unmask]]
> Date: Wednesday, February 26, 2003 12:10 PM
> À:  [log in to unmask]
> Objet:        Re: [TN] BGA rework equipment
> 
> Daan,
> 
> While the DRS24 is a nice system, I think it may have some of the same
> limitations as other hot-air machines of it's vintage. Airflow on these
> machines tends to move small parts around.  If you switch to a low flow
> option, it's sometimes difficult to get enough heat, especially if you
> have
> a small footprint board. We have both SRT 1100 and a DRS24 and find
> similar
> limitations.  It does also need nozzles.  A couple of systems I've looked
> at
> recently were impressive with their ability to handle small components.
> Metcal has a couple of hot-air units that are designed to handle very
> small
> BGAs, micro-BGAs, CSPs, etc. ERSA has an IR unit that we were very
> impressed
> with. It handled boards from small PCMCIA size to large 8x12 boards that
> are
> bonded to a .400" aluminum heatsink on both sides. It depends on visually
> watching the BGA ball drop, so it has some limitations due to visibility,
> but overall for a wide variety of work, it would be one I looked at.
> 
> Rick Thompson
> 
> Sr. SMT Process Engineer
> SMTEK International, Inc.
> +1 (805) 532-2800
> [log in to unmask]
> 
> 
> ===== Original Message from [log in to unmask] (TechNet E-Mail Forum.) at
> 2/26/03 8:30 am
> >Hi Technet,
> >
> >We're planning to replace our current BGA repair equipment by something
> >that's more suitable for fine-pitch BGA's and microBGA's (ballpitches
> >down to 0.5 mm).
> >We can get a brandnew Airvac DRS24 (or Zevac, as it's called in Europe)
> >for half the price, but then we need to decide about it very soon,
> >without having the time to do a good evaluation.
> >Time to seek some expert's advice.....
> >
> >A significant part of our production work is subcontracting, and new
> >customer-relations often start with doing some BGA-repairs for them.
> >It's always urgent (no time to order a nozzle), there's never a sample
> >board to adjust the profile, and normally there's hardly any free area
> >around the BGA. We see everything from fine-pitch BGA's to CBGA's, 40*40
> >mm heatsinked-BGA's and BGA-sockets, on boardthicknesses up to 5 mm.
> >From what I heard the Airvac is certainly one of the very best
> >rework-machines on the market, but I'm not sure if it is the best choice
> >(i.e. flexible enough) for our situation.
> >
> >Any recommendations ?
> >
> >Daan Terstegge
> >Thales Communications
> >Unclassified mail
> >Personal Website: http://www.smtinfo.net
> >
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