Hi Cathy,

It depends on the actual output of your current process. How much
rejects would you have if you would inspect your standard products
against the higher level specification ?  Do you normally have SMD-glue
in the solder joints ?  Are your QFP's placed with more than 25%
overhang ?  How far can you normally fill the PTH's in the wavesoldering
process ?
If your process is well under control I'd say the biggest impact is in
the area of manual assembly instructions.

Daan Terstegge
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net

>>> [log in to unmask] 02/26/03 05:38pm >>>
Hi,
Just a couple of questions,

What changes do you make in your process to build a class 3 product
when you
originally build to class 2?

How do you incorporate this into the pricing of the product?


Cathy Killen
Training Officer
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