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February 2003

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TechNet <[log in to unmask]>
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Date:
Wed, 19 Feb 2003 08:43:22 -0500
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Re: Ni/Sn
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joyce <[log in to unmask]>
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Electrolytic Ni or electroless Ni?  How thick is the layer, composition?
Shape, location? Diffusion parameter (how hot and how long)?
Environmental requirement (operation temp)?  Application of "particular"
Etc..
                                                           jk

>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Dennis Fritz
>Sent: Tuesday, February 18, 2003 9:10 PM
>To: [log in to unmask]
>Subject: Re: [TN]
>
>
>Just wondering if any of you metallurgists have a comment
>about copper tin intermetallics vs. nickel tin.  We have heard
>the NiSn IMC is indeed more brittle than the CuSn IMC's.  This
>is the contention of one particular industry group.
>
>Denny Fritz
>MacDermid, Inc.
>
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