Can anyone tell me where I can find land pattern design guidelines for
BGA's with .65 mm pitch? IPC-SM-782 only has pad dimensions for BGA's of
1.0 mm and greater.
I am placing a BGA which Hitachi calls its BP-240A package. The pad design
on the boards seems too small, only .0098" while the ball size according
to the spec is .0157".

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