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January 2003

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Subject:
From:
Scott Westheimer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 7 Jan 2003 12:47:01 -0500
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I only see these at the inner layer interface and the first copper plate. Do
you see any on the surface or between the flash plate and the pattern or
panel plate. If there is nothing on the surface and there is none between
the flash plate and pattern or panel plate than it has to be some type of
contamination on the inner layer.

My best guess.

Scott B. Westheimer
General Manager,
Gultech North Carolina
5800 McHines Place
Raleigh, North Carolina 27616
Phone: (919)872-0100
Fax: (919)713-4849
Cell: (919)649-1510
Toll Free: 1-866-gultech
[log in to unmask]
Web Page: www.gultechna.com
----- Original Message -----
From: "Randy" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, January 07, 2003 12:26 PM
Subject: Re: [TN] Small spots on etch line


> Boards are multilayer that have been thru a plasma etchback process.  Some
> of the pics show buried via innerlayers which were panel plated prior to
> lamination.  Multiple etch lines indicate electroless copper deposition,
> panel flash plating and a final pattern plate.
>      We have witnessed these circular voids after drill, after plasma
> etchback, after flash plating and in as received coupons.  We have one pic
> that plainly shows a black circle BETWEEN the electroless etch line and
the
> etch line showing the demarcation between the flash and pattern plating.
>
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