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January 2003

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Subject:
From:
"McFaddin, Wade" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 7 Jan 2003 11:48:39 -0600
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Hi Randy,

I would agree with what Joe said,  that some of these "voids" appear to be
individual glass fibers that have been plated over.  A good analysis via
SEM/EDS should be able to determine if these are voids or encapsulated glass
fibers.

Wade McFaddin

> -----Original Message-----
> From: Randy [SMTP:[log in to unmask]]
> Sent: Tuesday, January 07, 2003 11:26 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] Small spots on etch line
>
> Boards are multilayer that have been thru a plasma etchback process.  Some
> of the pics show buried via innerlayers which were panel plated prior to
> lamination.  Multiple etch lines indicate electroless copper deposition,
> panel flash plating and a final pattern plate.
>      We have witnessed these circular voids after drill, after plasma
> etchback, after flash plating and in as received coupons.  We have one pic
> that plainly shows a black circle BETWEEN the electroless etch line and
> the
> etch line showing the demarcation between the flash and pattern plating.
>
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