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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 7 Jan 2003 11:48:39 -0600 |
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Hi Randy,
I would agree with what Joe said, that some of these "voids" appear to be
individual glass fibers that have been plated over. A good analysis via
SEM/EDS should be able to determine if these are voids or encapsulated glass
fibers.
Wade McFaddin
> -----Original Message-----
> From: Randy [SMTP:[log in to unmask]]
> Sent: Tuesday, January 07, 2003 11:26 AM
> To: [log in to unmask]
> Subject: Re: [TN] Small spots on etch line
>
> Boards are multilayer that have been thru a plasma etchback process. Some
> of the pics show buried via innerlayers which were panel plated prior to
> lamination. Multiple etch lines indicate electroless copper deposition,
> panel flash plating and a final pattern plate.
> We have witnessed these circular voids after drill, after plasma
> etchback, after flash plating and in as received coupons. We have one pic
> that plainly shows a black circle BETWEEN the electroless etch line and
> the
> etch line showing the demarcation between the flash and pattern plating.
>
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