TECHNET Archives

January 2003

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 6 Jan 2003 23:31:35 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (25 lines)
Hello Jack,
Recently we have a problem with tombstone components.  Operators
were told to repair them by adding solder to the lifted  side of the
capacitors, so there is a solder connection  but one side of the component
remains lifted .
In my opinion this is not an acceptable condition because the capacitors
do not meet  the requirements of dimension J - Minimum End Overlap. The
other Quality Inspector disagrees on the bases that connection  has been
made by solder.
I wonder what is your opinion  in the matter? I would appreciate any input.

Regards,
Margaret

---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

ATOM RSS1 RSS2