Rick,
I have seen such stuff more than once , usually as result of too harsh
drilling combined with too strong positive etchback desmear and too high
current density in electrolytic copper plating.
Edward

> -----Original Message-----
> From: Steve Gregory [SMTP:[log in to unmask]]
> Sent: á éðåàø 27 2003 15:48
> To:   [log in to unmask]
> Subject:      Re: [TN] plating void pics
> 
> Morning All! 
> 
> Rick Babyak asked me to post some pictures for him. Go to: 
> 
> http://www.stevezeva.homestead.com 
> 
> And look at; "Fissure 1 & 2, and Void 1-4". 
> 
> Technetters, has anyone seen anything like this before. 
> 
> For background information we see this phenomenon on both 
> polyimide and FR-4 material.  The process is similar to both 
> material types: 
> Drill 
> Plasma Etch for desmear or etchback 
> Deburr (RO Water) 
> High pressure water wash (RO Water) 
> Electroless Copper (about 60 microinches) 
> Panel plate (Flash - about .25 mils) 
> Photo image, develop 
> Pattern Plate 
> 
> The picture identified as Fissure1 was pulled out at pattern 
> plate (No thermal contact). 
> All other pictures were taken after full processing. 
> 
> Rick Babyak 
> Process Engineer 
> 
> 
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