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Date: | Mon, 27 Jan 2003 10:34:16 -0500 |
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Rick,
Looks like poor electroless/flash plate coverage, possibly due to over
aggressive etchback. Do you require a 3-point, military style etchback?
Regard,,
Denis Morrissey
Steve Gregory
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01/27/2003 08:48 AM Subject
Re: [TN] plating void pics
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Morning All!
Rick Babyak asked me to post some pictures for him. Go to:
http://www.stevezeva.homestead.com
And look at; "Fissure 1 & 2, and Void 1-4".
Technetters, has anyone seen anything like this before.
For background information we see this phenomenon on both
polyimide and FR-4 material. The process is similar to both
material types:
Drill
Plasma Etch for desmear or etchback
Deburr (RO Water)
High pressure water wash (RO Water)
Electroless Copper (about 60 microinches)
Panel plate (Flash - about .25 mils)
Photo image, develop
Pattern Plate
The picture identified as Fissure1 was pulled out at pattern
plate (No thermal contact).
All other pictures were taken after full processing.
Rick Babyak
Process Engineer
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