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January 2003

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From:
"Karnwal, Pankaj" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 27 Jan 2003 07:55:52 +0100
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Hi All
 Further my Question  "IS the Oval shape pads on PCB for BGA  soldering
help for better analysis in x-ray inspection". We are using that type of
pads in our prod. and when we see the  round image of any  ball we assume
that this ball is not soldered properly and the solder flow is less so we do
rework for the same. Is that the correct method?
your opinion Pls.
Thanks
With regards
Pankaj Karnwal
QualityAssurance
BESL A-4,Sec-5 NOIDA,201301,INDIA
e mail : <mailto:[log in to unmask]>
Barco,innovators in image processing


> ----Original Message-----
> From: Werner Engelmaier [SMTP:[log in to unmask]]
> Sent: Monday, January 27, 2003 6:07 AM
> Subject:      Re: BGA micro cracks
>
> Hi David,
> When you get intermittents, that means you have a full crack not a
> micro-crack. Fractured solder joints are notorious for this, and cannot be
> found by X-ray or visual innspection. Your description makes me suspect
> not
> so much solder joint cracking, but interfacial separation due to 'black
> pad'
> or a similar problem causing an absence of a metallurgical bond.
> Cross-section some of these joints to see what you have, an effective
> screening procedure is vibration.
>
> Werner Engelmaier
> Engelmaier Associates, L.C.
> Electronic Packaging, Interconnection and Reliability Consulting
> 7 Jasmine Run
> Ormond Beach, FL  32174  USA
> Phone: 904-437-8747, Fax: 904-437-8737
> E-mail: [log in to unmask], Website: www.engelmaier.com
>
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