Bill,

We built several test vehicles with SnAgCu, SnAg, SnCu, and SnAgCuSb,
from various solder paste manufacturers within our Demonstration
Factory. We did not make any changes to our stencils or our screen
printing process from SnPb.

In fact, we did not make any changes within respect to screen printing
and component placement (solder paste tackiness). Of course, the reflow
soldering profile changed dramatically (between 240C and 260C peak
temperature). Give me a call OFF LINE (or anyone else on TechNet) and I
can share some information with you.

Hope this helps.

Lee Whiteman
Senior Manufacturing Engineer
E-Mail: [log in to unmask] <mailto:[log in to unmask]>
Ph: (610) 362-1200 x208
Fax: (610) 362-1290





-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Coleman, Bill
Sent: Friday, January 24, 2003 4:41 PM
To: [log in to unmask]
Subject: [TN] Lead Free Solder


I would like to ask the Technet group a question that some of my
customers ask me.  Are there any particular changes to stencil apertures
when converting to Lead Free Solder Paste.

Thanks,


William E. Coleman
Vice President - Technology
Photo Stencil An ISO 9001 Registered Company
4725 Centennial Blvd.
Colorado Springs, CO 80919
Phone # 719-535-8528
Fax #      719-599-4334
Cell #      719-331-2433
email:      [log in to unmask] <mailto:[log in to unmask]>

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