Brian Toleno,

In his initial posting, Bill Page said:
* "Shear tests indicate that our glue process is working."
* "And yet, parts fall off . Across chip suppliers and part numbers, across
solder mask types, across PWB vendors."

How do these statements tie-out with your thoughts on contaminated surface
on the missing components?

Dave Fish
----- Original Message -----
From: "Brian Toleno" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, January 23, 2003 7:25 PM
Subject: [TN] SMA Failure was RE: This is a new one on me


> It appears as if you had checked most of the common failure modes. The
fact
> that the "dot" was flat, indicates the components are not adhering to the
> component. This is most likely due to a surface contamination.  The most
> common contaminant we have observed is a silicone contamination on the
> component. This can be from a mold release agent used in the component
> molding process or Si-compound migration from other parts of the facility.
> If you would like we can discuss further off line.
>
> Brian J. Toleno, Ph.D.
> Sr. Applications Chemist
> Loctite Electronics
> 15051 East Don Julian Rd
> Industry, CA 91746
> Ph: 626-968-6511 x304
> Cell: 626-390-9562
>
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