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January 2003

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Subject:
From:
Kathy Kuhlow <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 24 Jan 2003 08:23:45 -0600
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I've used scrap PCB's or coupons that were processed before the production was dipped.  I could then confirm the process thickness.  Then also during the production run to control the viscosity and rate of dip was consistent with the initial setup.  We also used a heat curing (coating mfg suggested guidelines) process to speed up the cure time.  

Kathy  

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<!DOCTYPE HTML PUBLIC "-//W3C//DTD HTML 4.0 Transitional//EN"> <HTML><HEAD> <META http-equiv=Content-Type content="text/html; charset=iso-8859-1"> <META content="MSHTML 6.00.2715.400" name=GENERATOR></HEAD> <BODY style="MARGIN-TOP: 2px; FONT: 8pt MS Sans Serif; MARGIN-LEFT: 2px"> <DIV><FONT size=1>I've used scrap PCB's or coupons that were processed before the production was dipped.&nbsp; I could then confirm the process thickness.&nbsp; Then also during the&nbsp;production run to&nbsp;control the viscosity and rate of dip was consistent with the initial setup.&nbsp; We also used a heat curing (coating mfg suggested guidelines) process to speed up the cure time.&nbsp; </FONT></DIV> <DIV>&nbsp;</DIV> <DIV><FONT size=1>Kathy </FONT>&nbsp;</DIV></BODY></HTML> --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------

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