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January 2003

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Subject:
Re: Moisture sensitive
From:
"d. terstegge" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 22 Jan 2003 18:11:56 +0100
Content-Type:
text/plain
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text/plain (76 lines) 
Hi Paul,

If inproper baking/storage is applied you could certainly run into
trouble with non-BGA components. Especially some TQFP packages have
resulted in a few interesting hours for me, trying to figure out why
after soldering so many of these parts had one corner raised above the
pads.....

Daan Terstegge
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net

>>> [log in to unmask] 01/22/03 05:49pm >>>
Has anyone ever seen moisture damage in plastic IC's which are not
BGA's?



Paul Stolar

Materials Engineer

Baker Atlas

713-625-5376

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