Bill,
  Is your process a no-clean or OA process? If OA are you sure the
parts are coming off in the wave and not the wash cycle? If No-Clean
have you verified your flux and thermal processing of the wave solder
meet the vender specs?
  Can you narrow the missing components down to a specific type? For
example 3216 capacitors. I have seen in the past where some venders have
used a polishing method in the manufacturing of the caps that will
adversely effect the bonding of the epoxy to the cap.
  In the past I have had to change to and industrial type of epoxy due
to the customers request not to change component venders.

>>> [log in to unmask] 01/22/03 09:09AM >>>
Hey folks,

I've been in this business for over 20 years, and thought I had seen it
all,
but this is a new one. We're having problems with our glue/wave solder
process. Parts are falling off the board.

"That's not new," you say?
"Check your handling, stupid," you say?
"Check your glue cure process, stupid," you say?

Yep.
Shear tests indicate that our glue process is working.
We're using a product that is very widely used in the industry,
following
the manufacturer's recommended cure profile.

And yet, parts fall off -- as they go through the wave solder machine.
Adhesive stays put. Has a flat surface where the part used to be.
Pads are beautifully soldered...just no parts there.
And we have verified that the parts are present before the wave.

Across chip suppliers and part numbers, across solder mask types,
across PWB
vendors.

Is it just me?
Is the business finally catching up with me?
Should I give up and become a high school band director?

Your suggestions are welcome!

Bill Page
Kenosha, WI

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