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January 2003

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Subject:
From:
Guenter Grossmann <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 6 Jan 2003 10:46:40 +0100
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Rick

In LEADFREE 20 lead-free solderpastes where qualified:
- Ionic contamination
- Corrosiveness
- Wetting
- Uniformity of powder
- Metal content
- Contour stability
- Solderballing

The qualification was done by one of our project members from industry from the point of view whether or not the paste does conform to the requirements of this particular company.

From Koki the JT3SX-48-M301 was tested and showed excellent results in all tests.

Best regards

Guenter

EMPA
Swiss Federal Institute for Materials Testing and Research
Centre for Reliability
Guenter Grossmann,  Senior Engineer

8600 Duebendorf
Switzerland

Phone: xx41 1 823 4279
Fax :     xx41 1823 4054
mail:     [log in to unmask]

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