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January 2003

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Subject:
From:
Phil Nutting <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 22 Jan 2003 10:22:44 -0500
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text/plain (63 lines)
Not being an SMT expert, any chance of some sort of silicon or release agent on the parts?

-----Original Message-----
From: Bill Page [mailto:[log in to unmask]]
Sent: Wednesday, January 22, 2003 10:09 AM
To: [log in to unmask]
Subject: [TN] This is a new one on me


Hey folks,

I've been in this business for over 20 years, and thought I had seen it all,
but this is a new one. We're having problems with our glue/wave solder
process. Parts are falling off the board.

"That's not new," you say?
"Check your handling, stupid," you say?
"Check your glue cure process, stupid," you say?

Yep.
Shear tests indicate that our glue process is working.
We're using a product that is very widely used in the industry, following
the manufacturer's recommended cure profile.

And yet, parts fall off -- as they go through the wave solder machine.
Adhesive stays put. Has a flat surface where the part used to be.
Pads are beautifully soldered...just no parts there.
And we have verified that the parts are present before the wave.

Across chip suppliers and part numbers, across solder mask types, across PWB
vendors.

Is it just me?
Is the business finally catching up with me?
Should I give up and become a high school band director?

Your suggestions are welcome!

Bill Page
Kenosha, WI

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