Are the parts clean? Is the glue old (shelf life)? 1st time use this
glue in wave? How long between the glue dispensing and place the part
and cure? How much is the humidity in the plant? (60%?) Is the place
mechine really push the parts down (force)? Etc.etc. Are you sure no
body try to reduce cycle time to pull a fast one on you?
Jk
P.s. can you glue a parts and push off at wave temp easily?
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Bill Page
>Sent: Wednesday, January 22, 2003 10:09 AM
>To: [log in to unmask]
>Subject: [TN] This is a new one on me
>
>
>Hey folks,
>
>I've been in this business for over 20 years, and thought I
>had seen it all, but this is a new one. We're having problems
>with our glue/wave solder process. Parts are falling off the board.
>
>"That's not new," you say?
>"Check your handling, stupid," you say?
>"Check your glue cure process, stupid," you say?
>
>Yep.
>Shear tests indicate that our glue process is working.
>We're using a product that is very widely used in the
>industry, following the manufacturer's recommended cure profile.
>
>And yet, parts fall off -- as they go through the wave solder
>machine. Adhesive stays put. Has a flat surface where the part
>used to be. Pads are beautifully soldered...just no parts
>there. And we have verified that the parts are present before the wave.
>
>Across chip suppliers and part numbers, across solder mask
>types, across PWB vendors.
>
>Is it just me?
>Is the business finally catching up with me?
>Should I give up and become a high school band director?
>
>Your suggestions are welcome!
>
>Bill Page
>Kenosha, WI
>
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