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January 2003

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Subject:
From:
Bill Page <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 22 Jan 2003 09:16:34 -0600
Content-Type:
text/plain
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text/plain (82 lines)
Yeah, but I actually DO have a music degree.

BP

-----Original Message-----
From: Steve MacDonald [mailto:[log in to unmask]]
Sent: Wednesday, January 22, 2003 9:04
To: TechNet E-Mail Forum.; Bill Page
Subject: Re: [TN] This is a new one on me


In my expierence, Bill, the Industrial arts teachers are alot more fun to be
around.

Steve M.

----- Original Message -----
From: "Bill Page" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, January 22, 2003 10:09
Subject: [TN] This is a new one on me


> Hey folks,
>
> I've been in this business for over 20 years, and thought I had seen it
all,
> but this is a new one. We're having problems with our glue/wave solder
> process. Parts are falling off the board.
>
> "That's not new," you say?
> "Check your handling, stupid," you say?
> "Check your glue cure process, stupid," you say?
>
> Yep.
> Shear tests indicate that our glue process is working.
> We're using a product that is very widely used in the industry, following
> the manufacturer's recommended cure profile.
>
> And yet, parts fall off -- as they go through the wave solder machine.
> Adhesive stays put. Has a flat surface where the part used to be.
> Pads are beautifully soldered...just no parts there.
> And we have verified that the parts are present before the wave.
>
> Across chip suppliers and part numbers, across solder mask types, across
PWB
> vendors.
>
> Is it just me?
> Is the business finally catching up with me?
> Should I give up and become a high school band director?
>
> Your suggestions are welcome!
>
> Bill Page
> Kenosha, WI
>
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