Hi Iulian,
First, you should get copies of industry documents IPC-SM-785 "Guidelines for
Accelerated Reliability Testing of Surface Mount Solder Attachments,"
IPC-D-279 "Design Guidelines for Reliable Surface Mount Technology Printed
Board Assemblies," and IPC-9701 "Performance Test Methods and Qualification
Requirements for Surface Mount Solder Attachments."
Second, you may want to attend one of my workshops on this subject either at
APEX in March in Anaheim, California, Shanghai on April 10 or 11, or
Singapore, between May 7 and 12.
Third, you say "the product is manufactured as per the IPC-A-610C Class 2
requirements;" this assures quality but not reliability--for reliability it
needs to be designed according to IPC-D-279.
Fourth, the best T-cycle for your application is likely -20<->+100°C with 15
minutes dwells at each extreme--the acceleration factor to your uoperating
conditions can be determined from the above documents.
Fifth, you cannot perform any T-cycling without affectiong the reliability of
solder joints--how much you will affect it depends on a number of factors and
their interactions--that is what the obove documents and my workshops are all
about.
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com
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