Hi, Bev,

Class 1 stuff - no problem using excess solder to bridge two pins. All kind
of pooh is done to this class of baord to quickly and cheaply overcome a
problem. At the class 3 end I use small bits of mod wire bent into a
U-shape and soldered "compliantly" to the IC pins. This avoids the bulbous
joint syndrome (boy! that term's now fixed in everyone's minds!) and
variability of solder volume. The shape of the wire link also means that
there is more 'give' than there would be with solid solder, so you're not
likely to pull pads off boards during temp cycling.

Hope that helps

Peter



Bev Christian <[log in to unmask]>  17/01/2003 03:01 AM
Sent by: TechNet <[log in to unmask]>

Please respond to "TechNet E-Mail Forum."; Please respond to Bev Christian

              To:  [log in to unmask]
              cc:  (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
              Subject: [TN] Purposefully shorting two adjacent SOIC leads.








Technetters,
How do I do what is proposed in my title?  The options are using excess
solder or using a mod wire.  Are there other options for doing this mod?
What do people do?  What is allowed and not allowed by IPC standards (I
couldn't find anything, but then I may not be looking in the right place.)
I would expect option one would be a whole heck of a lot easier than option
2.  As long as option 1 doesn't produce bulbous joints with the solder all
the way up to the component body is there any real reason why I can't do
this?

regards,
Bev Christian
Research in Motion

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