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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 16 Jan 2003 15:58:51 -0700 |
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Hi Denis
IPC 7525 gives recommendations for aperture reductions for chip components
for no-clean solder paste applications. I would guess that more than 90% of
our stencil customers have us do some sort of aperture reduction for chip
components using no-clean paste. Home Plate is most popular with a 20 to
33% reduction.
William E. Coleman
Vice President - Technology
Photo Stencil An ISO 9001 Registered Company
4725 Centennial Blvd.
Colorado Springs, CO 80919
Phone # 719-535-8528
Fax # 719-599-4334
Cell # 719-331-2433
email: [log in to unmask] <mailto:[log in to unmask]>
----------
From: Dennis Bang [SMTP:[log in to unmask]]
Sent: Thursday, January 16, 2003 3:53 PM
To: [log in to unmask]
Subject: Re: [TN] Stencil Aperture Mod
Hi Carl
We reduce our apertures 5-10% (ddepending on apertures size) and
have
recently rectified our solder balls problem with homeplate apertures
for
chips. IPC-7525 have some guidelines which may be useful. You might
also
want to look at changing solder paste characteristics.
Regards
Dennis
-----Original Message-----
From: Carlr Ray [mailto:[log in to unmask]]
Sent: Friday, January 17, 2003 6:41 AM
To: [log in to unmask]
Subject: [TN] Stencil Aperture Mod
How many of you guys still run product with 1:1 apertures? How many
commonly use reduced or modified apertures?
I have an issue where I can not convince some other Engineers that
modifying the apertures to correct for solder balling is a good
solution.
The process is a no clean process and the profile meets the solder
paste manufactures recommended parameters.
The solder ball appear on next to the middle of the parts (like
solder
escapement) and some are trapped by the flux others or not.
Do you guys know of any standards that address these issues?
Carl Ray
Sr. Manufacturing Engineer
Huntsville, AL 35807
Phone: 256-882-4800 ext. 8845
Cell: 256-990-1990
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