TECHNET Archives

January 2003

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Coleman, Bill" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 16 Jan 2003 15:58:51 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (117 lines)
Hi Denis

IPC 7525 gives recommendations for aperture reductions for chip components
for no-clean solder paste applications.  I would guess that more than 90% of
our stencil customers have us do some sort of aperture reduction for chip
components using no-clean paste.  Home Plate is most popular with a 20 to
33% reduction.



William E. Coleman
Vice President - Technology
Photo Stencil An ISO 9001 Registered Company
4725 Centennial Blvd.
Colorado Springs, CO 80919
Phone # 719-535-8528
Fax #      719-599-4334
Cell #      719-331-2433
email:      [log in to unmask] <mailto:[log in to unmask]>

        ----------
        From:  Dennis Bang [SMTP:[log in to unmask]]
        Sent:  Thursday, January 16, 2003 3:53 PM
        To:  [log in to unmask]
        Subject:  Re: [TN] Stencil Aperture Mod

        Hi Carl
        We reduce our apertures 5-10% (ddepending on apertures size) and
have
        recently rectified our solder balls problem with homeplate apertures
for
        chips. IPC-7525 have some guidelines which may be useful. You might
also
        want to look at changing solder paste characteristics.

        Regards
        Dennis

        -----Original Message-----
        From: Carlr Ray [mailto:[log in to unmask]]
        Sent: Friday, January 17, 2003 6:41 AM
        To: [log in to unmask]
        Subject: [TN] Stencil Aperture Mod


        How many of you guys still run product with 1:1 apertures? How many
        commonly use reduced or modified apertures?

        I have an issue where I can not convince some other Engineers that
        modifying the apertures to correct for solder balling is a good
        solution.

        The process is a no clean process and the profile meets the solder
        paste manufactures recommended parameters.

        The solder ball appear on next to the middle of the parts (like
solder
        escapement) and some are trapped by the flux others or not.

        Do you guys know of any standards that address these issues?

        Carl Ray
        Sr. Manufacturing Engineer
        Huntsville, AL 35807
        Phone: 256-882-4800 ext. 8845
        Cell: 256-990-1990

        ---------------------------------------------------
        Technet Mail List provided as a free service by IPC using LISTSERV
1.8e
        To unsubscribe, send a message to [log in to unmask] with following
text in
        the BODY (NOT the subject field): SIGNOFF Technet
        To temporarily halt or (re-start) delivery of Technet send e-mail to
        [log in to unmask]: SET Technet NOMAIL or (MAIL)
        To receive ONE mailing per day of all the posts: send e-mail to
        [log in to unmask]: SET Technet Digest
        Search the archives of previous posts at:
http://listserv.ipc.org/archives
        Please visit IPC web site http://www.ipc.org/html/forum.htm for
additional
        information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700
        ext.5315
        -----------------------------------------------------

        Scanned by PeNiCillin http://safe-t-net.pnc.com.au/

        ---------------------------------------------------
        Technet Mail List provided as a free service by IPC using LISTSERV
1.8e
        To unsubscribe, send a message to [log in to unmask] with following
text in
        the BODY (NOT the subject field): SIGNOFF Technet
        To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
        To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
        Search the archives of previous posts at:
http://listserv.ipc.org/archives
        Please visit IPC web site http://www.ipc.org/html/forum.htm for
additional
        information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
        -----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

ATOM RSS1 RSS2