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January 2003

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Subject:
From:
Barry Gallegos <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 14 Jan 2003 15:03:49 -0700
Content-Type:
text/plain
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text/plain (71 lines)
Look to see if it is present prior to entering reflow.
could be placement machine Z height issue. or maybe
profile related. Is it always the same part number
or is it random. If not at placement then is the
reflow profile good? or might it be moisture related.
Just some thoughts.

Barry.

-----Original Message-----
From: Morse, Carrie [mailto:[log in to unmask]]
Sent: Tuesday, January 14, 2003 2:56 PM
To: [log in to unmask]
Subject: Re: [TN] Cracking SOT-23


Is it on the first pass or second pass side?

-----Original Message-----
From: Virgil Lenton [mailto:[log in to unmask]]
Sent: Tuesday, January 14, 2003 4:39 PM
To: [log in to unmask]
Subject: [TN] Cracking SOT-23


We are experiencing a small percentage of our SOT-23 components cracking
through the SMT process. Any suggestions as to what conditions might cause
these components to crack or break?

Thanks
Virgil

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