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January 2003

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Subject:
From:
Tim Reeves <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 14 Jan 2003 10:35:26 -0800
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I would disagree. The reason the gold is there is to prevent oxidation (passivation) of the underlying nickel. When that happens, it causes poor solderability--it's hard to solder to passivated nickel.

Best Regards,
Timothy Reeves


-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Monday, January 13, 2003 4:06 PM
Subject: Re: voids in gold plated holes



Marie,

Welcome to TechNet!

Although no expert, my reaction is that voids in the goldplating would not,
in itself, cause poor vertical fill in the holes. The gold should burn off
during soldering and wetting should be to the underlying Nickel (presumably
this is an ENIG board). It seems to me that the problem is either with the
underlying copper plating or else the Nickel layer plated onto that. Have
you done any cross-sections of affected areas?

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