In any case, the designer must communicate with the manufacturer to define
the layout according to the quality requirement : a design for IPC-Class 2
will not allow a production according to IPC-class 3 without touch-up.
ME Magnin
FIRSTEC SA
Rue du Grand Pré 70
CH 1211 Genève 2
Tél. : +41(0)22 918 36 85
Fax : +41(0)22 918 36 93
mailto:[log in to unmask]
http://www.firstec.ch
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Cyker, Howard A
> (Howie)
> Sent: mardi, 14. janvier 2003 17:13
> To: [log in to unmask]
> Subject: Re: [TN] Stencils
>
>
> Marcus,
>
> You and I are already in agreement, the manufacturing
> engineer (EMS) must
> design the stencil. However, if the board designer has
> specific solder
> volume requirements to meet solder joint attachment requirements (for
> certain components), then those volume requirements must be
> communicated to
> the manufacturing engineer to be incorporated into the stencil design.
>
> Howard A. Cyker
> Lucent Technologies
> Engineering Infrastructure - New Product Engineering
> Email [log in to unmask]
> Phone 978-960-2964
> Fax 978-960-2964
> Pager 888-961-2336
>
>
>
> -----Original Message-----
> From: [log in to unmask] [mailto:[log in to unmask]]
> Sent: Tuesday, January 14, 2003 10:50 AM
> To: TechNet E-Mail Forum.; Cyker, Howard A (Howie)
> Subject: Re: [TN] Stencils
>
>
>
> The board designer has no idea which process the PCB will be run i.e.
> water soluble vs noclean. The stencils for a water-soluble
> paste would less
> likely include home plate and other aperture modifications.
> Therefore it is
> my opinion that it must ultimately be the Mfg, Engineer 's
> job designing
> the actual stencil.
>
> Marcus Wheeler
> Sr. Mfg. Engineer
> Apsco International
> [log in to unmask]
> 440-352-8961 * 530
>
>
>
>
>
> "Cyker, Howard A
>
> (Howie)" To:
> [log in to unmask]
>
> <[log in to unmask] cc:
>
> > Subject: Re:
> [TN] Stencils
>
> Sent by: TechNet
>
> <[log in to unmask]>
>
>
>
>
>
> 01/14/2003 10:16
>
> AM
>
> Please respond to
>
> "TechNet E-Mail
>
> Forum."; Please
>
> respond to
>
> "Cyker, Howard A
>
> (Howie)"
>
>
>
>
>
>
>
>
>
>
> I agree with Mr. Croslin with supplying a 1:1 stencil layer
> artwork to the
> EMS provider so they can tailor the stencil design to their
> materials and
> assembly processes. One other consideration during stencil design is
> attachment reliability requirements. If the board designer
> has specific
> solder volume requirements (beyond industry (IPC) solder joint quality
> standards) to meet product reliability requirements, then these
> requirements must be communicated to the EMS provider for
> consideration
> when they design the stencil.
>
>
>
> Howard A. Cyker
> Lucent Technologies
> Engineering Infrastructure - New Product Engineering
>
> Email [log in to unmask]
> Phone 978-960-2964
> Fax 978-960-2964
> Pager 888-961-2336
>
>
> -----Original Message-----
> From: Croslin, Robert [mailto:[log in to unmask]]
> Sent: Tuesday, January 14, 2003 9:58 AM
> To: [log in to unmask]
> Subject: Re: [TN] Stencils
>
>
> >From a design standpoint, we provide our CEM houses with a one-to-one
> stencil layer embedded in our Gerber files. This allows them
> to adjust it
> appropriately based on their equipment, processes, stencil
> manfacturer,
> etc.
>
>
> Bob Croslin
>
> Nielsen Media Research
> -----Original Message-----
> From: Donald Kyle [mailto:[log in to unmask]]
> Sent: Tuesday, January 14, 2003 9:33 AM
> To: [log in to unmask]
> Subject: [TN] Stencils
>
>
> I would like your opinion on who would be more suited to
> design stencils for SMT PWBs; the board designer or the
> contract-manufacturing engineer.
>
> What do you do and why?
>
>
>
>
> Donald Kyle C.I.D.+
> 281-285-7528 ---------------------------------------------------
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