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January 2003

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Fri, 3 Jan 2003 08:49:55 -0500
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Process development and process control... If necessary, redesign.
                                              ;-( jk

>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall
>Sent: Thursday, January 02, 2003 11:27 PM
>To: [log in to unmask]
>Subject: [TN] Fine Pitch Component Usage After Initial Placement Errors
>
>
>Hello All,
>
>Can anyone give me some guidance on the best way to cut down
>on fine pitch component scrap?  We're trying to understand the
>gains and/or potential problems of re-using expensive
>components that were placed on boards with many scattered or
>missing discretes.  Currently we remove these from the board
>and send them to the repair department for later usage.  Many
>of the leads have traces of solder paste on them.
>
>Are there any better ways to accomplish this goal?
>
>Thanks in advance,
>
>Leland Woodall
>
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