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January 2003

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Tue, 14 Jan 2003 17:33:52 +0800
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Marie,



Are your boards to be conformally coated? If you're worried about exposed

copper, you could try filling the holes with dilute conformal coating -

though you will probably have to put the boards in a vacuum oven to pull

the air out of the holes and allow the coating to penetrate and coat the

walls of the holes.



Peter







ME Magnin <[log in to unmask]>    14/01/2003 04:02 PM

Sent by: TechNet <[log in to unmask]>



Please respond to me.magnin

                                                                                                                              

              To:  [log in to unmask]                                                                                            

              cc:  (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)                                                        

              Subject: Re: [TN] voids in gold plated holes                                                                    

                                                                                                                              

                                                                                                                              

                                                                                                                              











Thanks for this answer and all the others

I was not sure, when reading IPC A600 3.3.9, that it was talking about

copper voids or all plating voids. I understand now that the last is the

correct understanding.

I can see exposed red copper in these voids, I suppose there has been a

problem during nickel plating, thus consequently gold is missing too.

The number of voids is close to the acceptance limits, depending on the

standard I base on (IPC or PERFAG).

But my major concern is that the boards are finished now, and I am not sure

I can deliver them like this : bare copper is still exposed because I have

had poor vertical fill (we use a no-clean solder flux).







ME Magnin



FIRSTEC SA

Rue du Grand Pr¨¦ 70

CH 1211 Gen¨¨ve 2





T¨¦l.   : +41(0)22 918 36 85

Fax   : +41(0)22 918 36 93

mailto:[log in to unmask]

http://www.firstec.ch







 -----Original Message-----

 From: TechNet [mailto:[log in to unmask]]On Behalf Of [log in to unmask]

 Sent: lundi, 13. janvier 2003 20:58

 To: [log in to unmask]

 Subject: Re: [TN] voids in gold plated holes



 Marie

 If you look in IPC-6012A, para 3.3.3 There is a table 3.3 that has the

 requirements for Finish Coating.  Then depending upon which class your

 product has been built to meet, you can see the requirements.  Class 2

 says "Three voids allowed per hole in not more than 5% of the holes"  for

 example.



 Bare copper is always a reliability concern - especially if it is in

 contact with gold.  Remember that the nickel is put on to prevent the gold

 and copper from reacting.



 Susan Mansilla

 Robisan Lab ---------------------------------------------------

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