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January 2003

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From:
Guenter Grossmann <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 13 Jan 2003 09:26:08 +0100
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Carrie

We made wave soldering trials in LEADFREE with SnAgCu and played with the temperatures between 240°C and 280°C. What we saw was:
- 250°C-  260°C in the wave gave the best results in soldering. Higher solder temperatures caused icicles and increased bridges. The reason, in our opinion, is that higher temperature destroys the flux so that the PCB enters the second wave without flux.
- In one solder machine we found a  temperature difference of 20°C between the solder pot setting and the wave temperature.

Best regards

Guenter

EMPA
Swiss Federal Institute for Materials Testing and Research
Centre for Reliability
Guenter Grossmann,  Senior Engineer

8600 Duebendorf
Switzerland

Phone: xx41 1 823 4279
Fax :     xx41 1823 4054
mail:     [log in to unmask]

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