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January 2003

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Subject:
From:
"Bresnan, Thomas" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 10 Jan 2003 10:14:47 -0700
Content-Type:
text/plain
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text/plain (49 lines)
Planarity may be something to consider, if you're expecting to make contact
with the pad in some manner. We have mechanical specs we follow, but that
may not apply in your case.
regards,
Tom

-----Original Message-----
From: Franklin D Asbell [mailto:[log in to unmask]]
Sent: Friday, January 10, 2003 10:57 AM
To: [log in to unmask]
Subject: [TN] Visual inspection criteria from conductive epoxy-filled
vias


What specific inspection criteria should be followed for the visual
inspeciton of conductive epoxy-filled vias?

Besides the cross-sectional, thermal-shock, etc etc....what are some other
tests performed on this type feature???

Thanks,

Franklin D Asbell

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