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January 2003

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 9 Jan 2003 11:52:32 -0500
Content-Type:
text/plain
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text/plain (38 lines)
Yes, revision B of the J-STD had a nice set of Appendix thoughts. They
are not in the C revision. Those guidelines may appear in the IPC 7070
series of documents. I thought some of them were ready to print. I must
admit I have not kept up with my obligations to the committee. Sorry
everyone.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Kathy Kuhlow
> Sent: Thursday, January 09, 2003 9:30 AM
> To: [log in to unmask]
> Subject: Re: [TN] Help anyone!!!
>
>
> Well, I agree the dimension J is not in violation it is over
> the lands.  But in the J-STD 001 appendix B there is a
> section for Placement Requirements for SM parts I remember it
> had some additional requirements by device type for height
> off of the pads.
>
> I would question if these are ceramic chip caps and only one
> end of the device was soldered you may very well have caused
> cap cracks from thermal imbalance across the part.  I would
> replace all parts if only one side was soldered otherwise you
> may have a problem with leaky caps in test.
>
> Kat

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