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| Reply To: | TechNet E-Mail Forum. |
| Date: | Thu, 9 Jan 2003 08:30:19 -0600 |
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Well, I agree the dimension J is not in violation it is over the lands. But in the J-STD 001 appendix B there is a section for Placement Requirements for SM parts I remember it had some additional requirements by device type for height off of the pads.
I would question if these are ceramic chip caps and only one end of the device was soldered you may very well have caused cap cracks from thermal imbalance across the part. I would replace all parts if only one side was soldered otherwise you may have a problem with leaky caps in test.
Kat
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<DIV><FONT size=1>Well, I agree the dimension J is not in violation it is over
the lands. But in the J-STD 001 appendix B there is a section for
Placement Requirements for SM parts I remember it had some additional
requirements by device type for height off of the pads. </FONT></DIV>
<DIV><FONT size=1></FONT> </DIV>
<DIV><FONT size=1>I would question if these are ceramic chip caps and only one
end of the device was soldered you may very well have caused cap cracks from
thermal imbalance across the part. I would replace all parts if only
one side was soldered otherwise you may have a problem with leaky caps in
test. </FONT></DIV>
<DIV><FONT size=1></FONT> </DIV>
<DIV><FONT size=1>Kat</FONT></DIV></BODY></HTML>
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