IPC-600-6012 Archives

January 2003

IPC-600-6012@IPC.ORG
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Subject:
Re: Conductive Via Fill Requirements
From:
Mike Hill <[log in to unmask]>
Reply To:
(Combined Forum of D-33a and 7-31a Subcommittees)
Date:
Thu, 2 Jan 2003 14:18:19 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (90 lines) 
John,

I got it from the web site thanks.

mike

-----Original Message-----
From: IPC-600-6012 Mail Forum [mailto:[log in to unmask]]On Behalf Of
John Perry
Sent: Thursday, January 02, 2003 2:15 PM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] Conductive Via Fill Requirements


Opps.  Sorry about that.  Sure 'nuff, the link was hosed.  It should be
working properly now.

John Perry
IPC

-----Original Message-----
From: Clark F. Webster [mailto:[log in to unmask]]
Sent: Thursday, January 02, 2003 1:02 PM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] Conductive Via Fill Requirements


John,
I also tried to access D-33D and failed.
Regards,


Clark Webster
All Flex,Inc.
1705 Cannon Lane, Northfield, MN 55057
Ph:507.663.7162 Fax:507.663.1070
[log in to unmask] <mailto:[log in to unmask]>
www.allflexinc.com <http://www.allflexinc.com>





> -----Original Message-----
> From: IPC-600-6012 Mail Forum [mailto:[log in to unmask]]On Behalf Of
> John Perry
> Sent: Thursday, January 02, 2003 11:33 AM
> To: [log in to unmask]
> Subject: [IPC-600-6012] Conductive Via Fill Requirements
>
>
> Colleagues,
>
> IPC has a task group (D-33D) charged with developing a set of
> requirements for via protection (plug, fill, tent, etc) that will
> ultimately find a home in the IPC-2221 and IPC-6012 documents.
> At present, there is a strawman document for this effort,
> available through the IPC Committee Home Page located at
> http://members.ipc.org/commreg/default.asp
>
> There is an industry request within the 6012 task group for
> conductive via fill information, based on what now appears in
> 3.6.2.15 of the IPC-6012A document.  Given that a D-33d Strawman
> draft does exist, is there any additional information that can
> currently be provided to this question:
>
> 1. Are there any IPC specifications or specific Customer
> specifications that
> define the requirements for conductive via fill? For example, Amount of
> minimum fill, the surface flatness, etc.
>
> Note: IPC 6012 paragraph 3.6.2.15 "Resin Fill of Blind and Buried Vias"
> states that resin fill in buried via shall be at least 60% but there is no
> mention of Conductive Fill requirements.
>
>
> The D-33d Hole Protection Strawman can be downloaded through the
> above-mentioned website.  Select the "D-30 Rigid Printed Board
> Committee" and then use the "+" symbols to the left of each link
> to expand out to the D-33 Subcommittee and then subsequently the
> D-33D task group.  From here you will then be able to select
> "Drafts" on the right-hand side of the web page and access the
> strawman document in .pdf format.
>
> Regards,
>
> John Perry
> IPC
>

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