Hi Bill! We have conducted a number of Pbfree solder process investigations
and used the same stencil aperture designs guidelines as we do for Sn63
solder paste. We did have to alter some of the solder paste process
parameters due to solder paste rheology changes but our current stencil
aperture design rules worked just fine.
Dave Hillman
Rockwell Collins
[log in to unmask]
"Coleman, Bill"
<BColeman@PHOTOST To: [log in to unmask]
ENCIL.COM> cc:
Sent by: TechNet Subject: [TN] Lead Free Solder
<[log in to unmask]>
01/24/2003 03:40
PM
Please respond to
"TechNet E-Mail
Forum."; Please
respond to
"Coleman, Bill"
I would like to ask the Technet group a question that some of my customers
ask me. Are there any particular changes to stencil apertures when
converting to Lead Free Solder Paste.
Thanks,
William E. Coleman
Vice President - Technology
Photo Stencil An ISO 9001 Registered Company
4725 Centennial Blvd.
Colorado Springs, CO 80919
Phone # 719-535-8528
Fax # 719-599-4334
Cell # 719-331-2433
email: [log in to unmask] <mailto:[log in to unmask]>
---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------