1:1 only on alternate finish like Immersion Silver and Gold where you don't
have a solder base already. Otherwise we reduce everything 10%. Make all R's
and C'(even alternate board finishes) home plate design....bingo no more mid
chip beads (solder balls)
Dave C.
Manufacturing Engineer
Circuit Service Inc.

-----Original Message-----
From: Carlr Ray [mailto:[log in to unmask]]
Sent: Thursday, January 16, 2003 1:41 PM
To: [log in to unmask]
Subject: [TN] Stencil Aperture Mod


How many of you guys still run product with 1:1 apertures? How many
commonly use reduced or modified apertures?

I have an issue where I can not convince some other Engineers that
modifying the apertures to correct for solder balling is a good
solution.

The process is a no clean process and the profile meets the solder
paste manufactures recommended parameters.

The solder ball appear on next to the middle of the parts (like solder
escapement) and some are trapped by the flux others or not.

Do you guys know of any standards that address these issues?

Carl Ray
Sr. Manufacturing Engineer
Huntsville, AL 35807
Phone: 256-882-4800 ext. 8845
Cell: 256-990-1990

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