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January 2003

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"TechNet E-Mail Forum." <[log in to unmask]>, gosia <[log in to unmask]>
Date:
Thu, 9 Jan 2003 08:08:12 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>, Guy Ramsey <[log in to unmask]>
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Guy Ramsey <[log in to unmask]>
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Sounds like a defect to me. End overlap is required. Now if the
component is merely lifted but overlaps the land, you end up with a
debate. Maximum solder thickness is not defined. Just the same, Steve's
observations are valid. It is very easy to damage capacitors during hand
soldering rework.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of gosia
> Sent: Wednesday, January 08, 2003 9:54 PM
> To: [log in to unmask]
> Subject: [TN] Help anyone!!!
>
>
> Hello TechNet,
> Please help!!!
> Recently, we have a problem with tombstone components.
> Operators were told to repair them by adding solder to the
> lifted  side of the caps, so there is a solder connection
> but the side remains lifted . In my opinion this is not an
> acceptable condition because the capacitors do not meet  the
> requirements of dimension J - Minimum End Overlap. The other
> Quality Inspector disagrees on the bases that connection  has
> been made by solder. Where can I find specific standards for
> lifted SMT capacitors? Margaret

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