I am appalled by these atttepmts to "repair" a board. The amount of damage and degradation done to the circuit
poses a serious threat to the reliability, particularly for class 3 operation.

The concept of "repairable" finished SMT products is very misleading and potentaily dangerous.
The ability to repair circuits is a legacy from the old Mil Spec days and have no business in todays processes!
Smaller none repairable circuits must become the norm.

David A. Douthit
Manager
LoCan LLC


"Long, Thomas" wrote:

> Yes Mike.  I have done several with an Air-Vac.  The best way is to make
> sure you have solder above liquidus(use t-couple).   I would target a
> temp > 200 C for at least 30 seconds.  Since the Parylene will still
> have a good hold on the solder joints, you must shear through the joints
> using a spatula.  Once you get the hang of it, it is fairly simple and
> straight forward. Like I said, I have taken off quite a few with no
> problem on the pad side.  Some clean up of course is required prior to
> replacing a new part.
>
>                         Tom Long
>                         ITT Avionics
>                         Clifton, NJ
>
> -----Original Message-----
> From: WEEKES, MICHAEL HS-SNS [mailto:[log in to unmask]]
> Sent: Thursday, December 05, 2002 10:58 AM
> To: [log in to unmask]
> Subject: [TN] reworking paralyne (paraxylene) coated BGAs and uBGAs
>
> Hello fellow Technetters:
>
> Anyone have any experience removing  paralyne (paraxylene) coated BGAs
> and
> uBGAs with conventional air vac DRS 24 type hot air equipment - I tried
> conventional reflow profiles and it was very unsuccessful.
>
> [log in to unmask]
>
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