A spatula will work, or two made tools, miniature crow bars with
wide tips, place at opposite end of the BGA. When the right temperature is
reached, push the tools down and the BGA will raise up. Kapton tape the
tools so that they will not scratch the board.
Regards,
Ramon
> -----Original Message-----
> From: Long, Thomas [SMTP:[log in to unmask]]
> Sent: Thursday, December 05, 2002 2:53 PM
> To: [log in to unmask]
> Subject: Re: [TN] reworking paralyne (paraxylene) coated BGAs and
> uBGAs
>
> Yes Mike. I have done several with an Air-Vac. The best way is to make
> sure you have solder above liquidus(use t-couple). I would target a
> temp > 200 C for at least 30 seconds. Since the Parylene will still
> have a good hold on the solder joints, you must shear through the joints
> using a spatula. Once you get the hang of it, it is fairly simple and
> straight forward. Like I said, I have taken off quite a few with no
> problem on the pad side. Some clean up of course is required prior to
> replacing a new part.
>
> Tom Long
> ITT Avionics
> Clifton, NJ
>
> -----Original Message-----
> From: WEEKES, MICHAEL HS-SNS [mailto:[log in to unmask]]
> Sent: Thursday, December 05, 2002 10:58 AM
> To: [log in to unmask]
> Subject: [TN] reworking paralyne (paraxylene) coated BGAs and uBGAs
>
> Hello fellow Technetters:
>
> Anyone have any experience removing paralyne (paraxylene) coated BGAs
> and
> uBGAs with conventional air vac DRS 24 type hot air equipment - I tried
> conventional reflow profiles and it was very unsuccessful.
>
> [log in to unmask]
>
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