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December 2002

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Wed, 4 Dec 2002 08:53:26 -0500
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Techies,

    The paragraph below is from one of our design engineers asking about placing
BGAs on both sides of the board. I am not as up-to-date on this as I could be,
so I am asking for advice from the group.

"Recently I talked to Jerry about sequential lam PWB technology.  This
basically creates a double-sided board conceptually like the old Cu-Invar-Cu
double-sided boards, except without the core, and with the capability for
through-hole vias to connect the two sides.  If we use sequential lam, then it
will be natural to want to put BGA packages on both sides of the board,
otherwise we will not get the full benefit out of this.  I know this was taboo
the last time I asked, but I now need to ask in more detail if any options at
all exist for putting BGAs on both sides, and roughly what the cost impact might
be."

    Any help with experiences or further resources is most appreciated.

Thanks,

Stu Korringa
Product Quality Engineer
Smiths Industries-Aerospace
Grand Rapids, Mi.
616-241-8189


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