EIPC SPRING CONFERENCE PRAGUE
CHANGING CIRCUMSTANCES - NEW POSSIBILITIES
15-16 MAY 2003
Dear colleagues,
We kindly like to announce that the European Institute of Printed
Circuits (EIPC) will organise a conference in Prague, Czech Republic,
on the 15th and 16th of May 2003.
If you have an important message for your European colleagues and
clients, then this is the opportunity. Whether it concerns an
Environmental, Marketing & Management or Technology related subject,
your participation to the programme would be highly appreciated.
Please review the Call for Papers that follows; abstracts are due by
December 20, 2002.
Call for Papers
EIPC Spring Conference
The European Institute of Printed Circuits (EIPC) is extending an
invitation to companies and individuals active in the Packaging and
Interconnection Industry to submit abstracts for presentations at the
EIPC Spring Conference to be held on 15 and 16 May 2003 in Prague, Czech
Republic.
The purpose of the Spring Conference is to provide a platform for
speakers and delegates to exchange information on the current market
conditions, future innovation on interconnection and packaging as well
as assembly of electronic and opto-electronic circuits. Delegates and
visitors from throughout Europe will attend this event, offering
presenters the opportunity to reach a targeted audience of decision
makers and leaders of the international packaging and interconnection
industry.
Prague... the new heart of Europe?
Prague, with a population of almost 1.2 million people, is the capital
city of the Czech Republic which lies in the heart of Europe,
neighbouring with Germany, Austria, Slovakia and Poland.
Prague combines a richness of architecture and culture with the
stimulating atmosphere of a city rapidly developing into a modern
European capital. The city is a thriving business community engaged in
manufacturing, trade, technology and infrastructure. Therefore the
choice for Prague as location of the Spring Conference is rather
obvious, especially because of the fact that Eastern Europe is
classified as a growth market for the Packaging and Interconnection
industry.
Spring Conference Prague at a glance
The conference will be held on 15 and 16 May in one of the numerous
excellent conference facilities Prague has to offer. The venue will be
announced soon.
Abstracts for presentations in the following areas are invited:
Marketing and Management related subjects:
1. Market circumstances and trends
2. The markets for Telecommunications and Cellular design
3. The Automotive market
4. Supply Chain Management/Logistics
5. E-commerce, internet
6. Market Trends
7. Globalisation- Strategies and Alliances
8. Quality Management
9. Contract Assembly or Electronic Manufacturing Services (EMS)
10. Success strategies for small to medium sized companies
11. Any additional subjects on this topic appropriate to the conference
Technology related subjects:
1. Packaging and Applications
2. Opto-electronic Circuits and Packaging
3. MCM (Multi-Chip-Module) Technology
4. Interconnection and Packaging Design
5. DFM/Computer Integrated Manufacturing
6. Laminates and Dielectric Materials
7. Semiconductor Devices and Packaging Technology
8. Production Technologies
9. Assembly Technologies
10. Manufacturing Equipment and Automation
11. Surface Finish and Solder Mask
12. Electrical/Functional Testing
13. Inspection Technology (visual and automated optical inspection)
14. Quality and Reliability
15. Integrated Components
16. High Density Interconnects (HDI)
17. Flip Chip and Area Array
18. Any additional subjects on this topic appropriate to the conference
Environmental subjects:
1. Lead-free Materials and Processes
2. Halogen-Free Laminate and Dielectrics
3. ISO Certification
4. Waste Reduction/Waste Treatment/Recycling Technologies
5. Green Technologies
6. Any additional subjects on this topic appropriate to the conference
Notes for speakers...
The following guidelines are provided regarding the submittal of papers
and how they are to be presented at the Spring Conference in Prague.
* Papers should supply new technical, management or statistical
information and not be presented for commercial purposes.
* All presentations should be made in English. If the author has
problems with presenting in English, he or she should note this
situation on the Abstract Submission Form.
* Presentations should not make direct comparisons with competitors'
products.
* When the description of particular equipment is necessary for proper
understanding of the process, it shall be confined to technical aspects.
* Text files of the presentation will be required in a universal
application like MS Word or in Adobe Acrobat PDF format.
* Illustrations, graphics, tables or pictures (including presenter's
photograph) have to be electronically delivered in standard format and
in the appropriate resolution (75 dpi for electronic publication and/or
300 dpi for printed material).
* The author or presenter of an oral presentation will be offered a
complimentary one day conference registration, valid on the day the
author is invited to present.
Abstracts should include the following:
* Title of Presentation
* Author Listing; first/last name, affiliation, mailing address,
telephone, fax, e-mail
* Synopsis of the paper for future announcements
* Abstract text
* Biography: brief background on the principal/presenting author
Acceptance Criteria
Abstracts will be reviewed by the Program Committee, consisting of
experts coming from our industry. The official language of the
Conference is English, however simultaneous translations will be
provided into French, German, Italian or any other language(s) if the
number of delegates for each language mentioned gives occasion to do so.
Selections will be based on the following criteria:
* Contribution to the industry.
* The abstract should clearly describe the nature, content, key points,
and significance of the proposed paper.
* Presentations are to be strictly non-commercial and must focus on
technical merits of described processes.
* Proprietary and/or confidentiality issues as well as approvals should
be definitive at time of submission.
Instructions
Instructions will be included in an author's kit that will be mailed to
you on acceptance of your proposal. All presentations will be included
in the Proceedings (on CD-Rom) of the Spring Conference. Manuscripts and
attendance at the Conference will be required for inclusion in the
Proceedings.
Deadlines
* 1 page Abstract December 20th, 2002
* Notification of Acceptance January 18th, 2003
Instructions for Submission of Abstracts
Please submit by e-mail, fax or regular mail.
European Institute of Printed Circuits
PO Box 2060
6201 CD Maastricht
The Netherlands
Phone: +31-43-3440872
Fax: +31-43-3440873
E-mail: [log in to unmask]
To: EIPC (Fax: +31-43-3440873 or [log in to unmask])
Proposals must be submitted no later than December 20th, 2002.
Contact:
Name:
Title:
Company/University:
Mail Stop/PO Box:
Street:
Post Code:
City:
Province:
Country:
Phone:
Fax:
e-mail:
www-address:
Presenter (if different from Contact):
Name:
Title:
Company/University:
Mail Stop/PO Box:
Street:
Post Code:
City:
Province:
Country:
Phone:
Fax:
e-mail:
www-address:
Author (if different from Contact/Presenter):
Name:
Title:
Company/University:
Mail Stop/PO Box:
Street:
Post Code:
City:
Province:
Country:
Phone:
Fax:
e-mail:
www-address:
Title of Paper
Subject Category M-( ) T-( )
E-( )
Has this paper been published before? No ( ) Yes ( )
If yes, where?
when?
Introduction (synopsis of 100 words for future announcements)
Abstract (approx. 300 words for paper selection procedure)
Author's Biography (max 100 words)
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